The push toward 1-megawatt racks is forcing fundamental changes in data center architecture, including cooling, power delivery, rack design, and 3D-IC packaging. Higher rack densities may not be the ...

As AI moves from answering prompts to completing work, infrastructure has to optimize the full workflow around the model.

Both approaches scale toward packages as large as 240 mm x 240 mm, with a roadmap extending beyond 12x reticle integration ...

Heterogeneous integration does not simply increase complexity but redistributes where quality must be assured.

Researchers from Texas A&M University, KIMM, and UST published a technical paper titled “Self-Focusing Control for ...

Hardware and software development have traditionally been disconnected, creating little opportunity to optimize system-level performance and energy consumption. Development swings between specialized ...

HBM is a reliability bottleneck, requiring greater visibility into individual bonds and TSVs, and more sophisticated SI/PI ...

As AI clusters push beyond rack-scale limits, optical interconnects and circuit switching are reshaping how data centers scale.

A smaller set of fiber connectors that meet manufacturing test high insertion count will ease the cost burden for all. Test specifications and associated standardized test formats will facilitate data ...

OpenAI is developing its own AI accelerator using Broadcom. Anthropic is also rumored to be exploring doing its own chip. As the developers of the most popular frontier models, one can expect they’ll ...

Semiconductor leaders say hardware trust, verification, and lifecycle resilience must become core design requirements rather than late-stage additions.

Researchers from the University of Hong Kong, Fudan University, and National University of Singapore designed an analog content-addressable memory (CAM) utilizing 2D molybdenum disulfide (MoS 2) flash ...